1. Suitable for edge removal treatment of 6-8 "silicon wafers;

2. Two sets of mechanical suction cups automatically load and unload silicon wafers, which are transported by robots from the loading end to the lower suction cup and automatically aligned;

3. Handling of silicon wafers through vacuum suction cup adsorption;

4. There is an independent cutting slot at the cutting position, which can flush and cut the material automatically into the clip;

5. Design pure water reuse;

6. Edge removal accuracy of 0.6mm;

7. The control part adopts imported brands of PLC and HMI, and all electrical and wiring that may come into contact with acid mist are treated with PFA anti-corrosion insulation. The electrical cabinet CDA/N2 inflates to protect the electrical control components inside;

8. The front of the machine is equipped with one PTFE pure water gun and one PTFE nitrogen gun each placed on the right side.

9. The equipment design standards are implemented in accordance with the semiconductor industry standard (SEMI-S2-93), and the ISO9001 quality management system is standardized and guaranteed.