Semiconductor cleaning equipment

summary

Electronic industry cleaning is a broad concept that includes any process related to the removal of pollutants, but there are significant differences in cleaning methods for different objects. The physical and chemical cleaning methods widely used in the electronic industry can be roughly divided into two types in terms of operation: wet cleaning and dry cleaning. Wet cleaning has been widely used in electronic industry production. Cleaning mainly relies on the physical and chemical (solvent) effects, such as the adsorption, immersion, dissolution, and dispersion of chemical active agents, supplemented by physical effects such as ultrasound, spray, rotation, boiling, steam, and shaking to remove stains. These methods have different cleaning effects and application ranges, and their cleaning effects also vary to some extent. CFC cleaning has played an important role in past cleaning processes in terms of cleaning effectiveness and subsequent processes, but its use is limited due to its depletion of the atmospheric ozone layer. For alternative processes, during the cleaning process, it is inevitable to require subsequent drying processes (ODS cleaning does not require drying, but pollutes the atmospheric ozone layer and is currently limited in use), wastewater treatment, and high investment in personnel labor protection. Especially in the further development of electronic assembly technology and precision machinery manufacturing, higher requirements are being put forward for cleaning technology. Environmental pollution control has also led to an increasing cost of wet cleaning. Relatively speaking, dry cleaning has significant advantages in these areas, especially the cleaning technology mainly based on plasma cleaning has gradually been applied in industries such as semiconductors, electronic assemblies, and precision machinery.

operational principle

The mechanism of a plasma cleaning machine mainly relies on the "activation effect" of active particles in the plasma to remove surface stains on objects. From the perspective of reaction mechanism, plasma cleaning usually includes the following processes: inorganic gases are excited into a plasma state; Gas phase substances are adsorbed on the solid surface; The adsorbed group reacts with solid surface molecules to form product molecules; Analysis of product molecules to form gas phase; The reaction residue detaches from the surface.

application

Plasma was initially applied to clean silicon wafers and hybrid circuits to improve the reliability of bonding leads and brazing. For example, removing organic contamination from the surface of semiconductors to ensure good solder joint connections, wire bonding, and metallization, as well as organic contamination from the bonding surface left by the previous process in PCB and mixed circuit MCMS (multi chip assembly) mixed circuit, such as residual solder, excess resin, etc.

Selection Guide

Plasma cleaning machine selection:

1. Choose the appropriate cleaning method:

According to the process requirements, choose appropriate cleaning methods, namely vacuum plasma cleaning and atmospheric plasma cleaning.

2. Choose a well-known brand:

In terms of plasma cleaning, German technology is already very advanced (such as TIGRES, Plasma technology)

GmbH), plasma cleaning products have been popularized and applied in various fields. However, the plasma cleaning technology in China is still in its infancy and has not yet been improved.

matters needing attention

What precautions should be taken when running a plasma cleaning machine

1. Correctly set the operating parameters of the plasma equipment and execute them in accordance with the equipment manual;

2. Protect the distance