Mainly used for the final cleaning of silicon material polishing wafers and epitaxial wafer cleaning processes, to remove surface particles and metal ions from wafers.

1. The machine is made of imported Roland collar plates, which can work in acid corrosive environments for a long time. It is sturdy and durable, with double layer leak proof.

2. Wafer Cassette- Design technology for less cassette free robotic arm transmission and cassette free carrying cleaning system

3. High efficiency clean hot water slow pulling+IR infrared drying technology (or Marannoi effect drying technology)

4. Chemical liquid automatic supply system

5. Megasonic cycle cleaning technology

6. Technical indicators for information exchange and communication capabilities of MES systems

(1) Wafer size: 8 "compatible with 6" (2) Processing capacity: 50 pieces/slot

(3) Solution temperature: 50 ℃~80 ℃ ± 1 ℃ (4) Megasonic cleaning: 950KHz, 2400W

(5) Liquid preparation accuracy: ≤ 1% (6) Particle control: ≤ 20 pieces/piece @ 0.12 μ M

(7) ≤ 10 pieces/piece @ 0.16 μ M (8) Metal content: ≤ 1E10 atoms/cm2

(9) Production efficiency: ≥ 2750WPH