1. The machine is made of imported Roland collar plates, which can work in acid corrosive environments for a long time. It is sturdy and durable, with double layer leak proof.

2. Effective processing equipment for organic and inorganic substances on chip surface using SC1 and SC2 can clean 4 ", 5", and 6 "silicon wafers.

3. Can be designed for manual and fully automatic operation, using two robotic arms for more effective efficiency and cost reduction.

4. Cleaning capacity: 4-6 inch round plates, 25 pieces, 2 baskets/batch

5. Comprehensive alarm prompt function and anti daze design function.

6. Modular design of each process tank, with corrosion tank and pure water flushing tank placed in a unified leak proof chassis. The corrosion groove is designed with bottom exhaust to reduce exhaust air volume.

7. The process tank can be designed with lifting action for faster and more thorough cleaning.

8. The control part adopts imported brand PLC and HMI

9. The front of the machine is equipped with one PTFE pure water gun and one PTFE nitrogen gun each placed on the right side.

10. The equipment design standards are implemented in accordance with the semiconductor industry standard (SEMI-S2-93), and the ISO9001 quality management system is standardized and guaranteed.