1. Wafer slot immersion corrosion cleaning, specially designed rotary cage for automatic rotation and rotation of wafers.

2. The process results have a high degree of uniformity and consistency, ensuring corrosion effectiveness.

3. Fully automated control during the process, self-developed control system, and friendly human-machine interaction interface.

4. The nitrogen bubbling function allows the nitrogen pipeline to move parallel and evenly within the acid tank during operation, and the bubbling rate can be adjusted.

5. Multi stage fine filtration of chemical solution, recycling and automatic replenishment function.

6. Having the information exchange and communication capability of MES system.

7. The chemical solution has InLine heating and cooling constant temperature function.

8. Equipped with a dedicated device for wafer flipping.

9. Provide standard process solutions.

10. The cleaning machine provides maximum protection for silicon wafers through hardware and software configuration. In case of equipment shutdown under abnormal conditions, the mechanical arm is immediately mobilized to remove the silicon wafers from the chemical solution tank and place them in the QDR water tank for flushing, which can avoid excessive corrosion of the silicon wafers by the chemical solution. Under extreme conditions, when the robotic arm encounters a Down machine, the equipment immediately drains the chemical solution from the chemical solution tank and injects it into UPW, thereby reducing the excessive corrosion of the chemical solution on the silicon wafer.

11. Processing capacity: Chip diameter 4 inches to 12 inches, quantity 75 pieces/6 inches each time, 50 pieces/8 inches/12 inches

Corrosion accuracy: flatness increment δ TTV ≤ 1.5 μ M.

Usage: Wafer thinning, surface corrosion